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US Patent Issued to TAIWAN SEMICONDUCTOR MANFACTURING on Aug. 25 for "Method of manufacturing FinFET devices with backside power rail and backside self-aligned via" (Taiwanese Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,720,795, issued on Aug. 25, was assigned to TAIWAN SEMICONDUCTOR MANFACTURING Co. LTD. (Hsinchu, Taiwan). "Method of manufacturing FinFET devic... और पढ़ें


US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Aug. 25 for "Semiconductor structure and method for forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,720,796, issued on Aug. 25, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Semiconductor structure and met... और पढ़ें


US Patent Issued to Renesas Electronics Corportaion on Aug. 25 for "Semiconductor device" (Japanese Inventor)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,720,797, issued on Aug. 25, was assigned to Renesas Electronics Corportaion (Tokyo). "Semiconductor device" was invented by Takahiro Mori (Toky... और पढ़ें


US Patent Issued to Infineon Technologies Austria on Aug. 25 for "Semiconductor die and method of manufacturing the same" (Austrian, German Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,720,798, issued on Aug. 25, was assigned to Infineon Technologies Austria AG (Villach, Austria). "Semiconductor die and method of manufacturing... और पढ़ें


US Patent Issued to FUJI ELECTRIC on Aug. 25 for "Semiconductor device and method of manufacturing semiconductor device" (Japanese Inventor)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,720,799, issued on Aug. 25, was assigned to FUJI ELECTRIC Co. LTD. (Kawasaki, Japan). "Semiconductor device and method of manufacturing semicon... और पढ़ें


US Patent Issued to SAMSUNG ELECTRONICS on Aug. 25 for "Semiconductor device having a two-dimensional channel and method for fabricating the same" (South Korean Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,720,800, issued on Aug. 25, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor device having a two-dimensiona... और पढ़ें


US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Aug. 25 for "Transistor structure with low resistance contact" (Taiwanese Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,720,801, issued on Aug. 25, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Transistor structure with low r... और पढ़ें


US Patent Issued to SAMSUNG ELECTRONICS on Aug. 25 for "Semiconductor device" (South Korean Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,720,802, issued on Aug. 25, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor device" was invented by Gukhee... और पढ़ें


US Patent Issued to Intel on Aug. 25 for "Fabrication of gate-all-around integrated circuit structures having pre-spacer-deposition wide cut gates" (Oregon Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,720,803, issued on Aug. 25, was assigned to Intel Corp. (Santa Clara, Calif.). "Fabrication of gate-all-around integrated circuit structures ha... और पढ़ें


US Patent Issued to Applied Materials on Aug. 25 for "High-temperature implant for gate-all-around devices" (Massachusetts Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,720,804, issued on Aug. 25, was assigned to Applied Materials Inc. (Santa Clara, Calif.). "High-temperature implant for gate-all-around devices... और पढ़ें